Triple-beam system with a femtosecond laser for millimeter-scale 3D characterization — material removal up to ~15,000× faster than a standard Ga FIB, with nanometer-resolution imaging.
Ga ion-beam DualBeam for site-specific TEM lamella prep, automated Slice & View 3D reconstruction, and low-vacuum imaging of magnetic or non-conductive samples.
Transmission electron microscope for internal structure at the nanometer scale — bright-field imaging, STEM, and electron diffraction for biological and materials samples.